berliner glas group news - find press releases, participation in trade shows and conferences

White Papers & Technical Articles.

Adding Value Through Knowledge Transfer.

Berliner Glas Group employees working in design, engineering or technology service functions regularly participate in conferences as speakers and publish white papers and technical articles.

 

You can download these papers - right after a short registration - right here:

 

 

 

Berliner Glas White Paper Wafer backside particle reduction

White Paper
Wafer Backside Particle Reduction
(PDF, 728 KB)
published on February 24, 2016

 

Chucks are used in various areas of the semiconductor industry: in lithographic processes, inspection steps, coating, 3D integration, wafer handling, during etching processes etc.. During all these processes backside contamination (BSC) of wafers is a big problem. One source for backside contamination is the wafer chuck.

 

Berliner Glas designs and produces customized electrostatic and vacuum chucks with a specific pin or mesa design to make the chuck as resistant as possible to particle contamination. To reduce the contact area between the wafer and the chuck even more the specialists in the Berliner Glas development team continue their research constantly. The here presented White Paper shows results of measurements which were performed to investigate the behavior of the different pin properties in terms of added particle.

 

 

Technical Article Measuring Large Non-planar Optics

Technical Article
Measuring Large Non-planar Optics
(Link to the Wiley Online Library)
published on December 01, 2015

 

The evaluation of the surface form quality of large-scale optical components in general and large cylindrical components in particular is most challenging. Such surfaces can be measured with planar Fizeau-type interferometers equipped with computer generated holograms.

 

Berliner Glas wrote a technical article that provides an overview of the measurement process using sub-aperture stitching techniques, the degrees of freedom of the measuring system, the requirements on input data and the importance of error-corrected holograms.

 

This article was published in the December edition of the magazine Optik & Photonik (05/2015) and can be downloaded directly from the Wiley Online Library.  

 

 

Technical Article Corrosion of Borosilicate Glasses

Technical Article
Corrosion of Borosilicate Glasses
(PDF, 1,2 MB)
published on July 15, 2015

 

When glass comes in contact with water, the result is often the corrosion of the glass – the surface structure of the glass is changed. During the production processes – polishing, cleaning and etching – contact between the alkaline free borosilicate glass and water is inevitable. It is therefore essential to know what changes take place, in order to realize critical processing steps.

 

The Berliner Glas Group has researched and applied a variety of processes and so determined the effect of the different phases of production on the borosilicate glass.

 

The "IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect & Ceramic Microsystems Technologies CICMT 2015" took place at the "Fraunhofer IKTS" in Dresden, Germany, from April 20-23, 2015. During this conference - CICMT 2015 - the Berliner Glas Group presented the results of the above mentioned research. The most critical of these results were published in a technical article.

 

 

Technical Article High-Performance Mirror for Space Applications Using Anodic Bonding Technology

Technical Article
High-Performance Mirror for
Space Applications Using
Anodic Bonding Technology

(PDF, 289 KB)
published on November 11, 2014

 

The Berliner Glas Group attended the ‘International Conference on Space Optics’ (ICSO), 7-10 October 2014, with a presentation about space mirrors. The paper and presentation as well as all sessions of the conference can be reviewed in the ICSO Proceedings online resource.

 

This technical paper includes the technical requirements that have to be met by these mirrors, the solution of the Berliner Glas Group as well as the advantages that the design and the features of the mirrors provide. These plane elliptical shaped mirrors are part of the Synopta Coarse Pointing Assembly (CPA) being one of the key elements of the TESAT Spacecom Laser Communication Terminals (LCTs) that are used for laser communication in space.

 

 

 Clamping Force and Flatness

White Paper
Perfecting Chucks:
Clamping Force and Flatness

(PDF, 475 KB)
published on September 26, 2014

 

Chucks are used in various areas of the semiconductor industry: in lithographic processes, inspection steps, coating, 3D integration, wafer handling and during etching processes. Two key factors of chucks are clamping force and flatness. Therefore Berliner Glas has developed methods to model, test and optimize the effective clamping force and the resulting flatness.

Contact us

Marketing & Communications
Iris Teichmann
Fon +49 30 60 905-4950
iris.teichmann [at] berlinerglas.de